Products

Graphene Composite FIN

HDS designs and develops custom thermal solutions for electronics and energy storage systems.

HDS IS CURRENTLY DEVELOPING THE FOLLOWING TECHNOLOGIES:

Graphene Composite Fin (GCF™) – Patent Pending

The HDS Graphene Composite Fin (GCF™) provides advanced thermal conduction without the need to provide liquid-filled cooling fins. This technology provides a new material for use in battery packs, other energy storage systems, and power electronic applications.

KEY GCF FEATURES INCLUDE:

  • Patent-pending Technology
  • Outperforms thermal performance of passive Al or Cu plates
  • Offers thermal performance similar to complex liquid cooling systems
  • Reduced Size, Weight, and Power Consumption (SWaP)
  • Is lightweight and non-corrosive
  • Is easy to manufacture and assemble

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Graphene Composite Fin

Contact Us today for more detailed information.